Kumagai, Henry Y. & Shanefield, Daniel J. & Verdi, Fred W. Method for providing an adherent electroless metal coating on an epoxy surface, U.S. Patent 4,402,998. Retrieved from https://doi.org/doi:10.7282/T3BV7K0H
AbstractA method of electrolessly plating a substrate having a rubber-modified epoxy surface includes the steps of preheating the substrate and while still warm, sputter etching at least 50A. from its surface. The substrate is then vacuum metalized with an adhesion promoting metal film, coated with a catalytic layer and a metal is electrolessly deposited thereover.